NE-MW10 is a small experimental microwave plasma cleaning machine, which adopts 2.45GHz high-frequency microwave plasma technology. The desktop is designed with a small integrated design, compact size, and small footprint. It is suitable for laboratory research and development, small batch precision device mass production, and the equipment has no cavity electrode structure, no sputtering pollution, low temperature and mild treatment, and does not damage chips, ceramic substrates, wafers, etc PCB、 Precision components such as optical glass; The plasma has high activity density and good cavity uniformity, which can efficiently remove surface organic residues and oxide layers, and simultaneously achieve material surface activation modification, greatly improving adhesion, bonding, welding adhesion and process reliability.   

The whole machine is equipped with a touch sensitive intelligent PLC control system, which supports multiple sets of process recipe storage switching and is equipped with two precision flow controllers (MFC). The gas flow rate is precisely controllable and widely used in semiconductor packaging, DBC ceramic substrates, chip bonding pre-processing, bottom filling process, microelectronic components and substrate cleaning, wafer debonding and other occasions.